![]() ![]() ![]() Backside Inspection capabilities for chipping. Pick from wafer map with multiple binning. Full trace requirements (Manual) Tight placement accuracies. (5) Fully Automatic Pick Tools inluding Datacon EVO 2200 system. The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the Datacon 2200 evo is prepared for present and future processes and products. The Datacon 2200 evo plus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership.īesides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities. The Die Bonder Esec 2100 xP plus is the the 2 ndgeneration of the most flexible 300 mm high speed platform, capable of running the full range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. At its introduction, this innovative platform was awarded with the prestigious Swiss Technology Award.įINEPLACER® femto 2 Automated sub-micron Die Bonder It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership. The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm 3 sigma. For evaluation panel size of 305 mm x 227 mm a Datacon 2200 evo bonder was used. A complete machine enclosure allows very demanding applications in a controlled environment.ĭepending on the requirements, the modular FINEPLACER® femto 2 can be individually configured and retrofitted at any time to support new applications and technologies. Chip assembly for larger panels of 510 mm x 515 mm size was carried out in an ASM SiPlace CA3. ESEC 2008XP Die Bonder Refurbished - CSI Semi Manual die Bonders Electron Mec. This makes the system a perfect tool and reliable companion as applications migrate from product development to production. #DATACON 2200 EVO REFURBISH MANUAL#Ģ002 > buy from CAE Datacon 2200 Evo Manual Sway ESEC / BESI 2008. 4), as the 5G evolution is driven by the growing mobile communication. ![]() EquipMatching is a marketplace for used, surplus and refurbished equipment. It covers the entire workflow of inspection, characterization, packaging, final test and qualification in semiconductor, communications, medical and sensor technologies. We consider graphene-integrated photonics for telecom and datacom systems as an. ![]()
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